Onto Innovation

NSX 330

Q: Is the inspection destructive or non-destructive?

Inspection is entirely non-destructive. The wafer is not damaged or altered during the measurement, allowing further processing or repeated inspection at later steps.

Q: What is the typical throughput for this class of metrology equipment?

Throughput varies with the desired resolution, defect density, and scan area. Modern systems are designed to balance speed and sensitivity for production environments, often achieving inspection times compatible with high-volume manufacturing line rates.

Metrology & Inspection Supports non-standard wafer types (Mems, Taiko, Thin)Onto Innovation NSX 330 family

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The Onto Innovation NSX 330 is an inspection system. The Onto Innovation NSX 330 supports 4-inch to 12-inch wafers. The Onto Innovation NSX 330 supports non-standard wafer types including Mems, Taiko, and Thin.^[1]^[2]^[3]^[4]

NSX 330 — Inventory photo — Fig. 01NSX 330Inventory photo^[3]

Wafer size

Supports non-standard wafer types (Mems, Taiko, Thin)

Power

208-240 VAC^[3]

Vacuum

110 PSI^[5]

Optics

Supports up to 6 camera configurations^[3]

What it is

The Onto Innovation NSX 330 is a metrology and inspection system for semiconductor manufacturing.^[1]^[2]^[4]

The NSX 330 supports wafers from 4-inch to 12-inch sizes and supports non-standard wafer types including Mems, Taiko, and Thin.^[3]^[1]^[2]

How it works

The NSX 330 uses a 2D based image recognition platform with programmable lighting, a programmable motorized stage, and software for storage and retrieval of metrology results.^[3]^[1]

The NSX 330 includes review functions for navigation, display, annotation, and classification review, and it provides a full-scale defect review platform for quick classification.^[3]

Applications

The NSX 330 provides defect analysis and classification.^[3]^[1]

The NSX 330 supports inspection of non-standard wafer types including Mems, Taiko, and Thin wafers, and it supports large warpage above 12 mm and ultra-thin wafers below 50 µm.^[3]^[1]^[6]

The NSX 330 is used for macro inspection, defect review, and metrology on wafers in semiconductor production flows.^[4]

What do the numbers mean?

Power & electrical11

Voltage Range: 208-240 VAC^[3]; Single Phase, GND^[3]; 50/60 Hz^[3]
Rate Full Load Current: 12.75 Amps^[3]
Rating of Largest Motor or Load: 5 Amps^[3]; Single phase^[5]
Full load current: 12.75 Amps^[5]
Phase: Single Phase^[3]
Frequency: 50/60 Hz^[3]
Largest motor or load rating: 5 Amps^[3]
Phase: Single Phase, GND^[3]

Vacuum & pumping2

Maximum pneumatic working pressure: 110 PSI^[5]
Pneumatic working pressure: 110 PSI^[1]

Wafer handling9

With lens, robot, controller^[3]; Supports multiple types of wafers^[3]
Wafer size: Supports non-standard wafer types (Mems, Taiko, Thin)^[1]; Supports large warpage (>12mm) and ultra-thin wafers (<50μm)^[3]
Wafer size: 4-inch to 12-inch wafers^[1]
Special wafer handling: Supports large warpage (>12mm) and ultra-thin wafers (<50μm)^[3]
Wafer handling: With lens, robot, controller^[1]
Wafer types: Supports non-standard wafer types (Mems, Taiko, Thin)^[1]
Included items: With lens, robot, controller^[3]

Optics & imaging6

Supports up to 6 camera configurations^[3]; Resolution options from 10μm to 0.5μm^[3]
Camera configurations: Supports up to 6 camera configurations^[1]
Resolution: 10μm to 0.5μm^[3]
Optics: Supports up to 6 camera configurations^[1]
Resolution options: 10μm to 0.5μm^[1]

Control & software5

Multiple recipes can be shared across systems^[3]; NSX software supports storage and retrieval of metrology results^[3]; With HDD and Software^[5]
Software: NSX software supports storage and retrieval of metrology results^[1]
Client software: Provides T defect review client^[3]

Configuration & options19

HDD not included^[3]; Specifications:^[3]; 2D based image recognition platform with programmable lighting^[3]; Programmable motorized stage^[3]; Provides defect analysis and classification^[3]; Review station supports navigation, display, annotation, classification review^[3]; Full-scale defect review platform for quick classification^[3]
Category: Metrology & Inspection^[1]
Imaging platform: 2D based image recognition platform with programmable lighting^[1]
Stage: Programmable motorized stage^[1]
Functions: Provides defect analysis and classification^[1]
Review station: Supports navigation, display, annotation, classification review^[3]
Defect review platform: Full-scale defect review platform for quick classification^[3]
HDD: HDD not included^[3]
Review station: Built-in review station supports off-line review^[3]
Inspection type: Inspection system^[1]
Power: 208-240 VAC^[3]
Review functions: Navigation, display, annotation, classification review^[1]
Off-line review: Built-in review station supports off-line review^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Voltage Range208-240 VAC^[3]
ConfigurationSingle Phase, GND^[3]
Configuration50/60 Hz^[3]
Rate Full Load Current12.75 Amps^[3]
Rating of Largest Motor or Load5 Amps^[3]
ConfigurationSingle phase^[5]
Full load current12.75 Amps^[5]
Maximum pneumatic working pressure110 PSI^[5]
PhaseSingle Phase^[3]
Frequency50/60 Hz^[3]
Largest motor or load rating5 Amps^[3]
Pneumatic working pressure110 PSI^[1]
PhaseSingle Phase, GND^[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Is the inspection destructive or non-destructive?General reference — not yet source-verified

Inspection is entirely non-destructive. The wafer is not damaged or altered during the measurement, allowing further processing or repeated inspection at later steps.

What is the typical throughput for this class of metrology equipment?General reference — not yet source-verified

Throughput varies with the desired resolution, defect density, and scan area. Modern systems are designed to balance speed and sensitivity for production environments, often achieving inspection times compatible with high-volume manufacturing line rates.

Not publicly documented

The following facts about the NSX 330 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSX 330 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSX 330 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSX 330 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSX 330 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NSX 330 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (6)Every fact above is drawn from these public sources

[1]waferpedia.com — waferpedia.comwaferpedia.com
[2]Onto Innovation NSX 330 family | Waferpedia — waferpedia.comwaferpedia.com
[3]Inventory photo
[4]2D Defect Inspection Plus Metrology System | Onto Innovation — ontoinnovation.comontoinnovation.com
[5]Inventory photo
[6]NSX 330 B — Onto Innovation | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com