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Lam Research

AutoEtch 590

EtchLam Research AutoEtch 590 family
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Lam AutoEtch 590 is a cassette-to-cassette automatic plasma etching platform designed for semiconductor wafer processing. The Lam AutoEtch 590 has a parallel plate plasma etching configuration. The Lam AutoEtch 590 supports programmable process parameters including RF power, chamber pressure, gas flow control, electrode spacing, and multi-step process recipes.[1]

Lam Research logo
Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

What it is

The Lam Research AutoEtch 590 is a plasma etcher for semiconductor wafer processing.[1][3]

The AutoEtch 590 is a cassette-to-cassette automatic etching platform.[1]

How it works

The AutoEtch 590 uses automatic wafer handling, a plasma process chamber, and programmable process control.[1]

The AutoEtch 590 uses a double airlock chamber structure and a parallel plate plasma etching configuration.[1]

Where it fits in the process flow

The AutoEtch 590 is used for wafer processing applications that require stable plasma control, automated wafer handling, and repeatable process performance.[1]

Applications

The AutoEtch 590 is used for semiconductor plasma etching, thin film etching, oxide etching, research and development processing, university semiconductor laboratory applications, compound semiconductor process development, production wafer plasma processing, and general dry etch applications.[1]

What do the numbers mean?

Power & electrical2

Programmable parameters
RF power, chamber pressure, gas flow control, electrode spacing, multi-step process recipes[1]
Accurate?
Process parameters
Programmable RF power, chamber pressure, gas flow control, electrode spacing, and multi-step process recipes[1]
Accurate?

Wafer handling5

Cassette-to-cassette automatic plasma etching platform[1]
Accurate?
Wafer handling
Automatic cassette-to-cassette wafer handling; single wafer plasma etch processing platform[1]
Accurate?
Wafer size
4"~6"[1]
Accurate?
Wafer handling
Automatic cassette-to-cassette wafer handling[1]
Accurate?
Process platform
Single wafer plasma etch processing platform[1]
Accurate?

Control & software2

Control system
Upgraded Allwin21 PC controller and touchscreen monitor[1]
Accurate?
Control interface
Allwin21 upgraded PC controller and industrial touchscreen monitor interface[1]
Accurate?

Configuration & options5

Chamber structure
Double airlock chamber structure[1]
Accurate?
Plasma configuration
Parallel plate plasma etching configuration[1]
Accurate?
OEM
Lam Research[2]
Accurate?
Model
AutoEtch 590[2]
Accurate?
Equipment type
Etcher[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Programmable parametersRF power, chamber pressure, gas flow control, electrode spacing, multi-step process recipes[1]
  • Process parametersProgrammable RF power, chamber pressure, gas flow control, electrode spacing, and multi-step process recipes[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the Lam AutoEtch 590 accommodate?

The system supports wafers of 4-inch to 6-inch diameter.[1]

What chamber configuration does the AutoEtch 590 use?

The system has a double airlock chamber structure and a parallel plate plasma etching configuration.[1]

Was the AutoEtch 590 upgraded with a modern controller?

Many systems were upgraded by Allwin21 with a PC controller and touchscreen monitor interface, replacing the original legacy control hardware.[1]

What are typical applications of the AutoEtch 590?

Typical applications include semiconductor plasma etching, thin film etching, oxide etching, research and development processing, and compound semiconductor process development.[1]

Not publicly documented

The following facts about the AutoEtch 590 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AutoEtch 590 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the AutoEtch 590 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the AutoEtch 590 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the AutoEtch 590 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the AutoEtch 590 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
  2. [2]Equipment inventory listing
  3. [3]Lam Research Autoetch 590 - Rebuilt Plasma Etcher — spwindustrial.comspwindustrial.com
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Last updated Oct 7, 2026.

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