Lam Research
2300 e 5 Kiyo
The Lam 2300 e 5 Kiyo is an etch system. The Lam 2300 e 5 Kiyo includes three chambers and one strip chamber.[1]
What it is
The Lam 2300 e 5 Kiyo is a plasma etch system manufactured by Lam Research. The system is configured with three process chambers and one strip chamber. The system includes a TDK TAS300 loadport, a Kawasaki ATM robot, and a Brooks TM robot. Additional components include a Lam PCU, Lam VIOP, Lam Engenuity, Lam ESC power supply, Horiba gas box, MKS vacuum gauges, Teledyne air lock heating gauge, Edwards STP-XA3203CV turbo pump, Edwards SCU-1600 controller, and a Lam bias RF generator.[1]
How it works
General reference — not yet source-verifiedThe system includes a gas delivery system for precise flow of etchants and a vacuum system to maintain process conditions. The strip chamber is used for photoresist removal after the etch process.
Applications
General reference — not yet source-verifiedThe Lam 2300 e 5 Kiyo is used for etching conductor materials in advanced semiconductor nodes. Applications include gate etching, contact etching, and metal interconnect etching.
The strip chamber provides in-situ photoresist removal, reducing handling and cycle time. The system is designed for precise control of etch profiles and uniformity.
What do the numbers mean?
Power & electrical3
Vacuum & pumping8
Wafer handling2
Gas & chemistry1
- Horiba Gas Box[1]
Configuration & options8
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationLam ESC Power Supply[1]
- ConfigurationHoriba Gas Box[1]
- MKS E28D-29237 Process Vacuum Gauge0.1 Torr[1]
- MKS 625D-30518 Chamber Vacuum Gauge1 Torr[1]
- ConfigurationMKS 625D-30518 Fore Line Vacuum Gauge (10 Torr)[1]
- ConfigurationMKS TM Vacuum Gauge[1]
- ConfigurationEdwards STP-XA3203CV Turbo Pump[1]
- ConfigurationEdwards SCU-1600 Turbo Pump Controller[1]
- ConfigurationLam 3156110-214 Bias RF Generator[1]
- Turbo PumpEdwards STP-XA3203CV[1]
- Turbo Pump ControllerEdwards SCU-1600[1]
- Bias RF GeneratorLam 3156110-214[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How many process chambers does the Lam 2300 e 5 Kiyo system include?
The system includes three process chambers and one strip chamber.[1]
What loadport is used on this system?
The system uses a TDK TAS300 loadport.[1]
What type of robot is used for the atmospheric transfer module?
The system uses a Kawasaki ATM robot.[1]
What type of robot is used for the vacuum transfer module?
The system uses a Brooks TM robot.[1]
Not publicly documented
The following facts about the 2300 e 5 Kiyo are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 e 5 Kiyo are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2300 e 5 Kiyo are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2300 e 5 Kiyo are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2300 e 5 Kiyo are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2300 e 5 Kiyo is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Sep 8, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
