Kulicke & Soffa
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The Kulicke & Soffa 982 10 Plus Wafer is a wafer saw for dicing and grinding. The 982 10 Plus Wafer was manufactured in 2001.[1]
The Kulicke & Soffa 982 10 Plus Wafer is a wafer dicing saw used in semiconductor backend processing. The machine is manufactured by Kulicke & Soffa and is categorized under dicing and grinding equipment.[2][1]
Wafer dicing saws use a rotating blade to cut semiconductor wafers into individual dies along predefined streets. The 982 10 Plus Wafer model belongs to this class of equipment, applying a high-speed spindle and precision alignment system to separate wafers after processing.
Wafer dicing saws are positioned in the backend of semiconductor manufacturing. The dicing operation takes place after wafer processing and the application of dicing tape, with outputs moving to die attach, wire bonding, or packaging steps.
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The following facts about the 982 10 Plus Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 982 10 Plus Wafer are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 982 10 Plus Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 982 10 Plus Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 982 10 Plus Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 982 10 Plus Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 2, 2026.
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