Kulicke & Soffa
982-10 Dicing
The K&S 982-10 is a dicing saw manufactured by Kulicke & Soffa. The K&S 982-10 has a blade capacity of 2 inches. The K&S 982-10 uses a 200mm vacuum chuck.[1][2]
What it is
General reference — not yet source-verifiedDicing saws are used in semiconductor packaging to separate individual integrated circuit die from a wafer after front-end processing.
How it works
Applications
General reference — not yet source-verifiedDicing saws of this class are also used in the fabrication of discrete components and microelectromechanical systems (MEMS).
What do the numbers mean?
Power & electrical3
Vacuum & pumping1
Configuration & options3
Vintage & configurations
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Disco DAG 810 Automatic— Same function class: Dicing & Grinding, UnknownCompare in depthsource[4]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 982-10 Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 982-10 Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 982-10 Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 982-10 Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 982-10 Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 982-10 Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
- [3]Equipment inventory listing
- [4]Equipment inventory listing
Last updated Oct 2, 2026.
Compare with similar tools
View all →
The Disco DAG 810 is an automatic grinder for semiconductor wafer processing, offering a spindle rated at 4.2 kW, torque 5.9 N·m, and speed range 1,000 to 7,000 min⁻¹.
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
