KLA
EM TIC 3 X
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The KLA / Leica EM TIC 3 X is a polisher for 8-inch wafers. The EM TIC 3 X is designed to handle 8-inch wafer processing.[1]
What it is
General reference — not yet source-verifiedThe EM TIC 3 X is an ion beam cross-section polishing system used for preparing samples for electron microscopy analysis.
How it works
General reference — not yet source-verifiedThe system uses a broad ion beam to sputter material from a sample surface, creating a polished cross-section suited for high-resolution imaging.
The ion beam is generated from an inert gas source and directed at the sample to remove material without mechanical damage, preserving the structural integrity of the sample.
Where it fits in the process flow
General reference — not yet source-verifiedThe EM TIC 3 X is used in metrology and laboratory settings after wafer processing, not as part of the production line.
The tool prepares cross-sections of wafers or devices, which are then analyzed using scanning electron microscopy, transmission electron microscopy, or energy-dispersive X-ray spectroscopy.
Applications
General reference — not yet source-verifiedCommon applications include failure analysis of semiconductor devices, material science sample preparation, process development support, and quality control cross-sectioning.
The tool is also used for preparing cross-sections of materials such as metals, ceramics, and coatings for structural and compositional analysis.
What do the numbers mean?
Wafer handling1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the EM TIC 3 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the EM TIC 3 X are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EM TIC 3 X are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EM TIC 3 X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EM TIC 3 X are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EM TIC 3 X are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Sep 28, 2026.
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