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Fuji

NXT H Placement

Assembly / SMTFuji NXT family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Fuji NXT H is an SMT mounter capable of high-density placement, low-impact placement, and semiconductor placement. The NXT H supports direct pickup from wafers and placement of chips up to 60mm x 60mm. The NXT H features high-rigidity construction with linear motor movement and high-resolution cameras for high accuracy placement.[1]

NXT H Placement — Inventory photo
Fig. 01NXT H PlacementInventory photo[2]

What it is

The NXT H can be configured with an H02 head. With this head, the machine is capable of placing chips up to 60 mm by 60 mm.[2][3]

How it works

The NXT H supports cleanroom class 1000. The XY robot is cleanroom capable, and by setting a HEPA filter, an even better environment for semiconductors can be achieved.[1]

What do the numbers mean?

Wafer handling2

Feeding methods
Wafer and reel part placement, direct pickup from wafers[1]
Accurate?
XY robot cleanroom capability
Cleanroom capable; HEPA filter option available[1]
Accurate?

Optics & imaging1

Alignment system
High-resolution cameras[1]
Accurate?

Control & software1

User interface
15-inch touchscreen panel[1]
Accurate?

Configuration & options7

H02 Head[2]
Accurate?
Capable of 60mm x 60mm chip[2]
Accurate?
Head type
H02 Head[2]
Accurate?
Maximum chip size
60mm x 60mm[2]
Accurate?
Placement capabilities
High density, low impact, semiconductor[1]
Accurate?
Drive system
Linear motor movement[1]
Accurate?
Cleanroom class
Class 1000[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of interface does the NXT H use?

The NXT H is equipped with a 15 inch touchscreen panel and graphical interface that controls both the machine and the MWU12i operation.[1]

Not publicly documented

The following facts about the NXT H Placement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NXT H Placement are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the NXT H Placement are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the NXT H Placement are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the NXT H Placement are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the NXT H Placement is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]smt.fuji.co.jp — smt.fuji.co.jpsmt.fuji.co.jp
  2. [2]Inventory photo
  3. [3]NXT H Placement — Fuji | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 5, 2026.

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