Esec
ESEC_2100XP
What it is
The ESEC 2100XP is an automatic epoxy die bonder.[1]
How it works
General reference — not yet source-verifiedAutomatic epoxy die bonders apply a controlled amount of epoxy adhesive onto a substrate or leadframe and then place a die onto the adhesive with precise alignment and force.
The machine typically uses a pick-and-place mechanism with a vacuum collet to handle the die, an epoxy dispensing system, and a heated stage to cure or partially cure the adhesive.
Where it fits in the process flow
General reference — not yet source-verifiedThe ESEC 2100XP is used in the semiconductor packaging process flow, after wafer dicing and die sorting, and before downstream steps such as wire bonding, encapsulation, and final test.
In the assembly line, the die bonder receives singulated dies from a wafer tape or waffle pack and mounts them onto leadframes, substrates, or package carriers.
Applications
General reference — not yet source-verifiedThe ESEC 2100XP is designed for adhesive die attach applications using epoxy-based bonding materials.
- Die attach
What do the numbers mean?
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of machine is the ESEC 2100XP?
The ESEC 2100XP is an automatic epoxy die bonder.[1]
Not publicly documented
The following facts about the ESEC_2100XP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ESEC_2100XP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ESEC_2100XP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ESEC_2100XP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ESEC_2100XP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ESEC_2100XP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]surplus.infineon.com — surplus.infineon.comsurplus.infineon.com
Last updated Oct 2, 2026.
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