Esec 2100 hS iXplus

The Esec 2100 hS is the third generation of a flexible 300 mm high-speed platform, designed to run an extensive range of epoxy die attach applications. At its introduction, this platform concept won the Swiss Technology Award.^[1]

The Esec 2100 hS uses a revolutionary Phi-Y concept that combines rotational and linear movements to achieve a very short pick-and-place cycle time. A new lightweight and rigid pick-and-place structure, advanced trajectory control, and a liquid cooling system ensure excellent accuracy at high speed.^[1]

Real-time process monitoring is provided through four live images of the process zone, and constant status control is available via real-time wafer, strip, and magazine viewers. The machine uses new controller hardware with Gigabit Ethernet communication to enable advanced processes.^[1]

In semiconductor packaging, the die bonder receives singulated dies from a wafer dicing process and attaches them to a substrate or leadframe. The assembled substrate then proceeds to wire bonding, flip-chip interconnection, or other bonding steps, followed by encapsulation and trim/form operations.

The machine accommodates wafer sizes from 4 inches to 12 inches (on 8-inch or 12-inch wafer frames) and die sizes from a minimum of 0.25 mm (with a Small Die Kit) up to 20 mm. Placement accuracy is 20 µm at 3 sigma, with an optional 15 µm High Accuracy Mode.^[1]