Esec
Datacon 2200 evo plus
The Esec Datacon 2200 evo plus is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo plus is specified for wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames. The Esec Datacon 2200 evo plus supports epoxy, soldering, thermo-compression, and eutectic hot and cold processes.[1]
Plate 01Besi Datacon 2200 evo and Datacon 8800 Series die bonder /die bonding machine
GEEKVALUE SMT SolutionsWatch on YouTubePlate 02Datacon 2200 Bonder (Wafer level die Bonding)
francis BoeyWatch on YouTubePlate 03Datacon 2200 evo
GEEKVALUE SMT SolutionsWatch on YouTubePlate 04Datacon 2200 EVO Demo Video
Ollie Dunne Tara SemiWatch on YouTube
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
How it works
The Datacon 2200 evo plus uses a bond head with rotation through a full angular range and supports heated bonding as an option. The Datacon 2200 evo plus is built around multi-chip handling, with support for die pick from wafer, waffle pack, gel pack, or feeder and die place to carrier, boat, substrate, PCB, lead frame, or wafer.[2]
The Datacon 2200 evo plus supports hot and cold processes including epoxy, soldering, thermo-compression, and eutectic attachment. The Datacon 2200 evo plus also supports epoxy writing and stamping and flux dipping.[2]
Where it fits in the process flow
Applications
The Datacon 2200 evo plus is specified for epoxy die attach and multi-chip attach work. The Datacon 2200 evo plus is also used for flip chip applications.[2][3]
- Epoxy die attach
- TSOP
- FBGA
What do the numbers mean?
Wafer handling2
Performance7
Dimensions & facilities4
Configuration & options13
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Datacon 2200 evo advanced | — | — | Offers ± 3 µm @ 3s placement accuracy, ± 0.07° @ 3s rotational accuracy, and a new vision, optics, and camera system. | besi.com[4] |
| Datacon 2200 evo | — | — | Base platform with integrated dispenser, 12" wafer handling, automatic tool changer, and application-specific tooling. | besi.com[2] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the X/Y placement accuracy of the Esec Datacon 2200 evo plus?
The X/Y placement accuracy is ±7 µm at 3 sigma.[3]
What is the theta placement accuracy?
The theta placement accuracy is ±0.15° at 3 sigma.[3]
Does the Esec Datacon 2200 evo plus support a heated bond head?
Yes, a heated bond head is available as an option.[3]
What is the rotation range of the standard bond head?
The standard bond head provides rotation from 0° to 360°.[3]
Not publicly documented
The following facts about the Datacon 2200 evo plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Datacon 2200 evo plus are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Datacon 2200 evo plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Datacon 2200 evo plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Datacon 2200 evo plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Datacon 2200 evo plus are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]besi.com — besi.combesi.com
- [3]micro-power.com.hk — micro-power.com.hkmicro-power.com.hk
- [4]besi.com — besi.combesi.com
Last updated Oct 6, 2026.
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