2007 SSI

The Esec 2007 SSI is a die bonder manufactured by Esec.^[1]

Die bonders typically operate by ejecting a die from a wafer tape using a push-up needle or ejector pin, then picking it with a vacuum collet. The collet transfers the die to a placement site where alignment is performed using optical systems. Bonding force and temperature are applied to create a mechanical and electrical attachment.

The bonding head may include heated or ambient collet options, and the substrate stage often provides heating for eutectic or solder reflow processes. Some die bonders incorporate vision systems for pattern recognition and alignment compensation.

Die bonders are used after wafer dicing and before wire bonding or encapsulation. The process receives singulated die from wafer tape and attaches them to substrate pads or package cavities. Following die bonding, parts typically proceed to wire bonding, flip-chip interconnection, or encapsulation.

In a typical semiconductor packaging production line, die bonding is a critical step that determines die placement accuracy and bond quality, affecting subsequent process yields.

Die bonders of this class handle a variety of die sizes and attachment materials, such as epoxy paste, film adhesive, or solder preforms, depending on the package design and reliability requirements.