Disco

DFG 841 Grinder Lapper

CMP Robot Unit– automated wafer handling between cassettes and chuck tables.Disco DFG 841 family

Research Quality: 50% complete

The Disco DFG 841 Grinder Lapper is a grinder/lapper/polisher for 8-inch wafers. The Disco DFG 841 Grinder Lapper includes robot-based automated wafer handling between cassettes and chuck tables. The Disco DFG 841 Grinder Lapper uses two chuck tables of porous vacuum type.^[1]^[2]

DFG 841 Grinder Lapper — Inventory photo — Fig. 01DFG 841 Grinder LapperInventory photo^[1]

Wafer size

Robot Unit– automated wafer handling between cassettes and chuck tables.

Power

AC 200V, 50/60 Hz, 3-Phase, 17 kVA^[1]

Vacuum

Two chuck tables(porous vacuum type).^[1]

What it is

General reference — not yet source-verified

A grinder lapper is a back-end wafer surface conditioning tool used to reduce thickness and improve surface flatness. Grinder lappers are used in semiconductor manufacturing to mechanically process wafers before later finishing or downstream assembly steps.

How it works

The Disco DFG 841 uses in-feed grinding with wafer rotation. The machine uses two porous-vacuum chuck tables, a robot unit for automated wafer handling, and automatic cassette loading and unloading with same-cassette return.^[1]^[2]

The machine includes a vacuum coolant unit for cooling and chip removal, a chiller unit for stabilizing grinding fluid temperature, and a filter unit for grinding water and coolant circulation. The machine also includes a contact gauge system for wafer thickness measurement.^[1]

Applications

The Disco DFG 841 is used for wafer thinning, grinding, lapping, and polishing on 8-inch wafers. The machine supports coarse and fine grind configurations.^[1]^[2]

What do the numbers mean?

Power & electrical5

Power: AC 200V, 50/60 Hz, 3-Phase, 17 kVA^[1]; Transformer (20 kVA, Tokyo Sanyo Denki) – converts facility power (208–415 V input → 200 V output).^[1]; Electrical Compartment– control and power distribution^[1]
Transformer: 20 kVA, Tokyo Sanyo Denki; converts facility power (208–415 V input to 200 V output)^[1]
Electrical compartment: Control and power distribution^[1]

Vacuum & pumping4

Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).^[1]; Two chuck tables(porous vacuum type).^[1]
Vacuum coolant unit: Provides cooling and chip removal; separate floor-standing unit^[1]
Chuck tables: Two chuck tables, porous vacuum type^[1]

Wafer handling10

Grinding Method: In-feed grinding with wafer rotation^[1]
Accuracy: Planarity ≤ 1.5 µm across wafer^[1]
Wafer size: Robot Unit– automated wafer handling between cassettes and chuck tables.^[1]; Automatic cassette loading/unloading with same-cassette return.^[1]
Wafer size: Wafer thickness measurement(contact gauge system).^[1]
Wafer size: 8 inch^[1]
Planarity accuracy: ≤ 1.5 µm across wafer^[1]
Robot unit: Automated wafer handling between cassettes and chuck tables^[1]
Cassette handling: Automatic cassette loading/unloading with same-cassette return^[1]
Wafer thickness measurement: Contact gauge system^[1]

Control & software2

with HDD and Software^[1]
Control/software: With HDD and Software^[1]

Dimensions & facilities1

Cooling Water: 0.2 MPa (2 kgf/cm²), 11 L/min^[1]

Configuration & options11

Spindle Speed (Max): 7,000 rpm^[1]
Air Requirement: 0.5 MPa (5 kgf/cm²), 300 L/min (ANR)^[1]
Cutting Water: 0.2 MPa (2 kgf/cm²), 15 L/min^[1]; Chiller Unit– stabilizes grinding fluid temperature.^[1]; Filter Unit– for grinding water/coolant circulation.^[1]
Spindle options: Configurable for coarse + fine grind^[1]
Make: Disco^[1]
Model: DFG 841^[1]
Tool type: Grinder / Lapper / Polisher^[1]
Chiller unit: Stabilizes grinding fluid temperature^[1]
Filter unit: For grinding water/coolant circulation^[1]

Interested in this tool?

Need help with this tool?Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

PowerAC 200V, 50/60 Hz, 3-Phase, 17 kVA^[1]
ConfigurationVacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).^[1]
ConfigurationTransformer (20 kVA, Tokyo Sanyo Denki) – converts facility power (208–415 V input → 200 V output).^[1]
ConfigurationElectrical Compartment– control and power distribution^[1]
ConfigurationTwo chuck tables(porous vacuum type).^[1]
Vacuum coolant unitProvides cooling and chip removal; separate floor-standing unit^[1]
Transformer20 kVA, Tokyo Sanyo Denki; converts facility power (208–415 V input to 200 V output)^[1]
Electrical compartmentControl and power distribution^[1]
Chuck tablesTwo chuck tables, porous vacuum type^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What wafer size does the Disco DFG 841 handle?

The Disco DFG 841 handles 8-inch wafers.^[1]^[2]

What grinding method does the Disco DFG 841 use?

The Disco DFG 841 uses in-feed grinding with wafer rotation.^[1]

Does the Disco DFG 841 include automated handling?

The Disco DFG 841 includes a robot unit for automated wafer handling between cassettes and chuck tables and automatic cassette loading and unloading with same-cassette return.^[1]^[2]

Not publicly documented

The following facts about the DFG 841 Grinder Lapper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 841 Grinder Lapper are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFG 841 Grinder Lapper are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFG 841 Grinder Lapper are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 841 Grinder Lapper are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 841 Grinder Lapper is not on record.
Answerable by: an OEM datasheet or a fab qualification report