Disco
The Disco DFD 6361 is an automatic dicing saw. The Disco DFD 6361 uses three-phase electrical power at 50/60 Hz. The Disco DFD 6361 is specified with 200-240 VAC, 18 A full load current, 20 A main breaker rating, and 8 A ampere rating of largest load.[1]

A water cooling system removes heat and debris during the cutting process.
An automated pattern-recognition system aligns the wafer to the blade before cutting.
The dicing saw is used after wafer thinning and before die-attach or wire-bonding processes.
The machine separates the wafer into individual chips that are then packaged or assembled.
The saw can cut wafers made of silicon, compound semiconductors, and other brittle materials.
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The following facts about the DFD 6361 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6361 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6361 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6361 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6361 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6361 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 11, 2026.
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