CHA

600

Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The CHA 600 is a high vacuum deposition system from CHA Industries. The related CHA SEC-600 E-Beam Evaporator is available for users to evaporate their own metal sources. The CHA SEC-600 can accommodate small samples through 100 mm wafers.^[1]

CHA600

No photo available yet

Power

2-10 kW^[2]

Vacuum

High vacuum deposition system^[2]

Optics

Optically dense, chevron baffle^[2]

Where it fits in the process flow

The CHA 600 can accommodate small samples through 100 mm wafers, which places it in work on laboratory-scale substrates and smaller wafer formats.^[1]

What do the numbers mean?

Power & electrical2

Electrical utility: 208/10/70A/4-wire connection with ground (3 phase, 5-wire also available)^[2]
Substrate heat: 2-10 kW^[2]

Vacuum & pumping10

System type: High vacuum deposition system^[2]
Pumpdown time: Average pumpdown time of less than 30 minutes^[2]
Ultimate vacuum: 10^-8 torr range^[2]
Cryogenic pump: 8"^[2]
Mechanical pump: 23-57 CFM, dual stage^[2]
High vacuum valve: 7-3/4" I.D., seals vertically^[2]
Foreline/Roughing valves: 3" I.D.^[2]
Valve actuation: Electro-pneumatic (all vacuum valves)^[2]
Optional diffusion pump: 2400 liter/second, 6" normal^[2]
Baseplate options: 20" or 26" diameter, 7-3/4" pumping port^[2]

Wafer handling3

Fixture capacity: Planetary Fixturing having a capacity of 18 4" wafers^[2]
Throughput: In excess of 54 wafers per hour^[2]
Substrate size capacity (SEC-600): Small samples through 100 mm wafers^[1]

Optics & imaging1

Water baffle: Optically dense, chevron baffle^[2]

Control & software2

Baseplate: Typically 20 inches; accommodates up to 15 feedthroughs for instrumentation, control and rotary motion^[2]
Ionization gauge control: Dual ionization gauge tube, auto ranging with dual convectron positions^[2]

Dimensions & facilities2

Dimensions: 79"H x 43"W x 37"D^[2]
Weight: 1,200 pounds^[2]

Configuration & options9

Bell jar: Most often 19.5" diameter bell jar^[2]
Cold trap: 2.5 liter capacity, 200 sq. inches of surface area, 10 hours holding time^[2]
Valve sequencing: Manual and automatic (Auto-Tech II)^[2]
Water utility: 10 GPM (minimum)^[2]
Air utility: 90-110 PSIG^[2]
Process chamber option: 19.5" diameter x 30" H, ambient or water-cooled (larger bell jars available)^[2]
Deposition sources: Any commercially available source, including single and multiple beam, CHA's resistance and sputtering sources^[2]
Deposition capability (SEC-600): E-Beam Evaporator available for users to evaporate their own metal sources^[1]
Approved deposition materials (SEC-600): Al, Au, Ag, Cu, Cr, Ge, Ni, Mo, Pd, Pt, Ti and others on case-by-case basis^[1]

Interested in this tool?

Need help with this tool?Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

System typeHigh vacuum deposition system^[2]
Pumpdown timeAverage pumpdown time of less than 30 minutes^[2]
Ultimate vacuum10^-8 torr range^[2]
Cryogenic pump8"^[2]
Mechanical pump23-57 CFM, dual stage^[2]
High vacuum valve7-3/4" I.D., seals vertically^[2]
Foreline/Roughing valves3" I.D.^[2]
Valve actuationElectro-pneumatic (all vacuum valves)^[2]
Electrical utility208/10/70A/4-wire connection with ground (3 phase, 5-wire also available)^[2]
Optional diffusion pump2400 liter/second, 6" normal^[2]
Baseplate options20" or 26" diameter, 7-3/4" pumping port^[2]
Substrate heat2-10 kW^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What substrate sizes can the CHA 600 handle?

The CHA can accommodate small samples through 100 mm wafers.^[1]

Which deposition materials are approved for the CHA 600?

Approved deposition materials include Al, Au, Ag, Cu, Cr, Ge, Ni, Mo, Pd, Pt, Ti, and others on a case-by-case basis.^[1]

Not publicly documented

The following facts about the 600 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 600 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 600 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 600 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 600 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 600 is not on record.
Answerable by: an OEM datasheet or a fab qualification report