Waferpedia

CEE

200XD

The CEE 200XD is a develop spinner. The CEE 200XD accepts up to 6 in wafers. The CEE 200XD is part of the photolithography spin/bake/expose/develop equipment at Utah Nanofab.[1][2]

CEE200XD
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Where it fits in the process flow

The CEE 200XD Develop Spinner sits in the lithography area of the cleanroom process flow, alongside other spin coaters, aligners, and ovens.[2]

Applications

The CEE 200XD Develop Spinner is used with lift-off resist workflows at Utah Nanofab.[1]

  • Lithography

What do the numbers mean?

Wafer handling2

Wafer capacity
Accepts up to 6 in wafers[3]
Accurate?
Wafer size
Accepts up to 6 in wafers[1]
Accurate?

Configuration & options4

Model
CEE 200XD[1]
Accurate?
Tool type
Develop Spinner[1]
Accurate?
Tool owner
Brian Baker[1]
Accurate?
Serial number
2122257[1]
Accurate?
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What replaced it?

  • siblingCEE 100— Listed in the same lithography spin coater group.source[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What process class does the CEE 200XD Develop Spinner belong to?

The CEE 200XD Develop Spinner belongs to the lithography spin coater class.[2]

Where is the CEE 200XD Develop Spinner placed in the cleanroom equipment set?

The CEE 200XD Develop Spinner is grouped with spin coaters in the lithography area, alongside aligners and ovens.[2]

Not publicly documented

The following facts about the 200XD are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 200XD are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 200XD are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 200XD are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 200XD are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 200XD is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
  2. [2]Equipment Page | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
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Last updated Oct 3, 2026.