Besi
2200 EVO Plus Die Bonder Hybrid
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA die bonder picks up individual semiconductor dies and places them onto a target surface such as a package substrate or leadframe. A hybrid die bonder combines placement functions associated with different bonding approaches within one platform.
Where it fits in the process flow
General reference — not yet source-verifiedThe Besi / Datacon 2200 EVO Plus Die Bonder Hybrid belongs in the back-end assembly flow after wafer processing and die singulation. The machine performs die attachment before later packaging and interconnect steps.
Applications
General reference — not yet source-verifiedDie bonding is used for semiconductor packaging tasks that require attaching bare dies to package structures. The class is also used for assembly work that needs placement of chip-scale parts onto prepared carriers or substrates.
The hybrid die bonder format suits production environments that need flexibility across bonding methods within packaging operations.
What do the numbers mean?
No specifications recorded yet
Be the first to add cited specifications for this tool.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does a die bonder do?General reference — not yet source-verified
A die bonder places a bare semiconductor die or similar component onto a package carrier or substrate and attaches it using a bonding method suited to the assembly.
What makes a hybrid die bonder different?General reference — not yet source-verified
A hybrid die bonder is a machine class that supports more than one attachment approach or process path, allowing different bonding methods to be handled on one platform.
What kinds of products use die bonding?General reference — not yet source-verified
Die bonding is used in packaged semiconductor devices, modules, sensors, and other assemblies that require precise attachment of a small die to a carrier.
Not publicly documented
The following facts about the 2200 EVO Plus Die Bonder Hybrid are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 2200 EVO Plus Die Bonder Hybrid are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2200 EVO Plus Die Bonder Hybrid are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2200 EVO Plus Die Bonder Hybrid are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2200 EVO Plus Die Bonder Hybrid are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 EVO Plus Die Bonder Hybrid are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Equipment inventory listing
- [3]Equipment inventory listing
- [4]Equipment inventory listing
Last updated Oct 7, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
