Axcelis
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The Axcelis Integra is an etch system. The Integra handles 12-inch wafers. A variant of the Integra is the Integra ES Plasma Dry Strip.[1][2][3]
The Axcelis Integra is an etch tool for semiconductor manufacturing.[2]
An etch tool selectively removes material from wafer surfaces by exposing patterned areas to a controlled plasma or reactive process.
Plasma etch systems generally use energized process gases, a chamber, and wafer handling hardware to shape material removal across the wafer.
Etch equipment is used after pattern definition to transfer features into the underlying film stack.
Etch processing sits between lithographic patterning and later cleaning, stripping, or deposition steps in a fabrication flow.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Integra ES Plasma Dry Strip | — | — | ES Plasma Dry Strip variant; 3-phase, 50/60 Hz power. | waferpedia.com[3] |
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The Axcelis Integra is an etch tool.[2]
The following facts about the Integra are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Integra are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Integra are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Integra are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Integra are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Integra is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 1, 2026.
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