Applied Materials
DPS II
Applied Materials DPS II is an etch tool. Applied Materials DPS II is a second-generation 300mm tool. Applied Materials DPS II has a chamber that can be used for either silicon or metal etch.[1][2]
What it is
The DPS II is a 300-millimeter-capable etcher that can be configured for either silicon or metal etch processes.[1]
How it works
Where it fits in the process flow
General reference — not yet source-verifiedIn a semiconductor fabrication line, etch tools like the DPS II follow photolithography and pattern development. The etcher transfers the photoresist pattern into the underlying film, after which the wafer moves to resist strip and wet-clean stations.
Applications
In silicon etch applications at the 0.15-micron node, the DPS II has demonstrated critical dimension uniformity of less than 10 nanometers across a 300-millimeter wafer, including edge die. For metal etch, the system has shown wafer-to-wafer and chamber-to-chamber critical dimension uniformity of less than five percent.[1]
What do the numbers mean?
Wafer handling6
Gas & chemistry1
Dimensions & facilities1
Configuration & options7
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DPS II CIP | — | — | — | waferpedia.com[3] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Onboard subsystemscontroller, endpoint, and gas panel located onboard the tool[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the DPS II support?
The DPS II is designed as a 300-millimeter tool but is scalable for 200-millimeter wafers.[1]
What types of etch can the DPS II perform?
The DPS II chamber can be configured for either silicon etch or metal etch.[1]
What critical dimension uniformity can the DPS II achieve in silicon etch?
For 0.15-micron gates, the DPS II has demonstrated a critical dimension uniformity of less than 10 nanometers across a 300-millimeter wafer.[1]
What temperature control mechanism does the DPS II use?
The DPS II uses a proprietary dual-zone ceramic wafer chuck for precise temperature control.[1]
What plasma source does the DPS II employ?
The DPS II uses a patent-pending dual coil tunable plasma source.[1]
Not publicly documented
The following facts about the DPS II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DPS II are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the DPS II are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DPS II are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DPS II is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DPS II are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]edn.com — edn.comedn.com
- [2]Inventory photo
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 1, 2026.
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