Applied Materials
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The Applied Materials DPS 2 532 is a metal etcher.[1]
The decoupled design separates ion generation from the biasing of the wafer to allow independent control of etch rate and profile.
The etcher typically follows metal deposition and photolithography steps and precedes resist stripping and cleaning operations.
The tool can also etch barrier and adhesion layers such as titanium nitride or titanium tungsten.
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The following facts about the DPS 2 532 Metal are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the DPS 2 532 Metal are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DPS 2 532 Metal are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DPS 2 532 Metal are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DPS 2 532 Metal are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DPS 2 532 Metal are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 1, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
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