Applied Materials
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A dry etcher removes material from a wafer using a process gas rather than liquid chemistry.
The etch chamber creates a controlled plasma environment that directs reactive species toward exposed regions on the wafer surface.
The tool follows lithographic pattern definition and precedes later cleaning, metrology, and downstream process steps that use the etched features.
Dry etch tools of this class are used for anisotropic material removal in integrated-circuit fabrication.
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The following facts about the Centura Enabler 300 Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura Enabler 300 Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura Enabler 300 Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura Enabler 300 Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura Enabler 300 Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura Enabler 300 Dry is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.