Applied Materials
9500 XR 200 S
The Applied Materials 9500 XR 200 S System is a semiconductor processing system configured for 6‑inch wafers. The system includes a CT‑10 Cryos chamber, an IHC source, dual bellows extraction at 60 kV, and post‑acceleration up to 160 kV for a total energy of 200 kV.[1]
How it works
Ion implanters generate a beam of ions from a source gas or solid material, accelerate the ions to a controlled energy, and direct the beam onto a semiconductor wafer. The 9500 XR 200 S uses a 40-amp source magnet and dual bellows extraction at 60 kV, with post-acceleration up to 160 kV, yielding a maximum total energy of 200 kV.[1]
Wafer handling includes a hollow gripper with a wafer-on-gripper sensor, and an orientation system and flat-not-found sensor that are fitted but not in use. The wafer wheel uses direct drive, and the tilt range is 0 to 7 degrees.[1]
What do the numbers mean?
Power & electrical4
- 50/60 Hz[1]
Vacuum & pumping4
- Pump Config:[1]
Wafer handling3
Gas & chemistry2
- Gas Box:[1]
Control & software1
Configuration & options22
- Enlarged Chamber[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Phase3 Phase + Neutral[1]
- Configuration50/60 Hz[1]
- Voltage208 V[1]
- ConfigurationGas Box:[1]
- ConfigurationPump Config:[1]
- ChamberCT-10 Cryos[1]
- Source TurboSTP-1000C[1]
- Mrs TurboSTP-361C[1]
- Power3 Phase + Neutral - 50/60 Hz - 208 V[1]
- Gas Box GasesBF3: SDS, PH3: SDS, AsH3: SDS, SiF4: SDS, Argon: External Feed[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
What wafer size does the Applied Materials 9500 XR 200 S support?
The Applied Materials 9500 XR 200 S supports 6-inch wafers.[1]
What is the maximum total energy of the Applied Materials 9500 XR 200 S?
The maximum total energy is 200 kV, with post-acceleration up to 160 kV.[1]
What dopant gas sources does the Applied Materials 9500 XR 200 S support?
The gas box supports SDS-based BF3, PH3, AsH3, and SiF4, plus an external argon feed.[1]
Does the Applied Materials 9500 XR 200 S have a plasma flood gun?
Yes, the system includes an HDPFS plasma flood gun for charge neutralization.[1]
Not publicly documented
The following facts about the 9500 XR 200 S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 9500 XR 200 S are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 9500 XR 200 S are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 9500 XR 200 S are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 9500 XR 200 S are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 9500 XR 200 S is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Sep 22, 2026.