UF 200 F

The Accretech UF 200 F is a wafer prober used for semiconductor test and probe operations. The machine is classified under the Test & Probe category of semiconductor manufacturing equipment. The Accretech UF 200 F is manufactured by Accretech, formerly known as TSK.^[1][2]

Wafer probers are used to make temporary electrical contact with individual die on a semiconductor wafer for testing purposes. The prober positions a wafer on a chuck and aligns probe needles or probe cards to the bond pads of each die, enabling parametric or functional testing before the wafer is diced. The UF 200 F is an automated prober that handles wafers and performs stepping operations to test each die in sequence.

The UF 200 F is used in the test and probe stage of semiconductor manufacturing, after wafer fabrication and before dicing and packaging. In this step, individual integrated circuits on the wafer are electrically tested to identify known good die. The prober is typically connected to a test head or tester that supplies signals and measures responses.

Wafer probers like the UF 200 F are used in the semiconductor industry for wafer-level testing of integrated circuits, including logic, memory, and mixed-signal devices. The machine is part of the final electrical test step performed before wafers are sent for dicing and packaging.