Accretech

FP 2000

Test & Probe Accretech FP 2000 family

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The Accretech FP 2000 is a fully automated 200 mm frame handling prober. The Accretech FP 2000 has an integrated frame-gripper function. The Accretech FP 2000 supports testing entire wafers and wafers on dicing frames.^[1]^[2]

FP 2000 — Inventory photo — Fig. 01FP 2000Inventory photo^[3]

What it is

The FP2000 is a semiconductor probing machine in the Accretech line.^[2]^[1]^[3]^[4]

The FP2000 is a frame handling prober for wafer-level test and probing work.^[1]^[2]

How it works

The FP2000 aligns wafers and adjusts probe needle contact position automatically.^[1]

The FP2000 performs precision measurement on wafers and on cut wafers or packages that are attached to dicing frames.^[2]

Where it fits in the process flow

The FP2000 sits in semiconductor test and probe operations.^[3]^[4]^[2]^[1]

The FP2000 supports work on wafers on dicing frames and on standard wafers used in probe-based device testing.^[1]^[2]

Applications

The FP2000 supports testing entire wafers and wafers on dicing frames.^[1]

The FP2000 supports CSP and WLCSP devices that are affixed on dicing frames.^[2]

What do the numbers mean?

Wafer handling1

Supported wafer sizes: 5", 6", and 8"^[1]

Configuration & options6

Model: FP 2000^[3]
Category: Test & Probe^[5]
Type: Prober^[3]
Automation: Fully automated^[1]
Frame handling: Integrated frame-gripper function^[1]
Frame size: 200 mm^[2]

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the FP2000 support?

The FP2000 supports standard wafers in sizes of 5 inch, 6 inch, and 8 inch.^[1]

Does the FP2000 handle wafers on dicing frames?

The FP2000 supports wafers on dicing frames.^[1]

Not publicly documented

The following facts about the FP 2000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FP 2000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FP 2000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FP 2000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FP 2000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FP 2000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report