Tool family
The SLR Series is a plasma processing system line for load-locked parallel-plate processes including RIE, PECVD, ICP, and ECR. The SLR B2 designation is not explicitly described in the provided source text.
The SLR Series is a plasma processing system line for load-locked parallel-plate processes including RIE, PECVD, ICP, and ECR. The SLR B2 designation is not explicitly described in the provided source text.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| SLR-720 | — | — | Reactive Ion Etch system with RF-powered substrate electrode and circulating-liquid temperature control. | nanofab.utah.edu[1] |
| SLR-730 | — | — | PECVD system with RF-powered top electrode and substrate temperature control by embedded resistance heater; stated temperature range is 80 C to 400 C. | nanofab.utah.edu[1] |
| SLR-734 | — | — | PECVD/RIE combination system with RF power switchable between top and bottom electrodes; substrate temperature control by embedded resistance heater; stated temperature range is 80 C to 400 C. | nanofab.utah.edu[1] |
| SLR-740 | — | — | PE/RIE combination system with RF power switchable between top and bottom electrodes and circulating-liquid temperature control. | nanofab.utah.edu[1] |
| SLR-770 ICP | — | — | ICP system with top coil supplied 2 MHz RF at 1000 Watts maximum and bottom electrode supplied 13.56 MHz RF at 500 Watts maximum. | nanofab.utah.edu[1] |
| SLR-770 ECR | — | — | ECR system with lower electrode RF power and temperature control, plus a tuner, a high density source with an electromagnet, and a microwave power supply. | nanofab.utah.edu[1] |