Esec E142 on Esec Die Bonder

Models in this family

1. 

   E142 on Esec Die Bonder3rd generation

   The Esec E142 on Esec Die Bonder is an E142 strip mapping option for the Esec 2100 hS die bonder platform. The Esec 2100 hS is a high-speed die bonder for epoxy die attach applications with wafer sizes from 4 inches to 12 inches.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Esec 2100 hS iXplus	—	—	—	besi.com[1]
   Esec 2100 sD advanced i	—	—	—	besi.com[1]
   Esec 2100 hS i	—	—	—	besi.com[1]
   Esec 2100 hS	3rd generation	—	Flexible 300 mm high speed platform for epoxy die attach applications.	besi.com[1]
   Esec 2100 SC Strip Mapping	—	—	—	besi.com[1]
   E142 on Esec Die Bonder	—	—	Strip mapping option; CSR required.	besi.com[1]

Sources