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Esec Datacon 2200 evo
Tool family
Esec Datacon 2200 evo
Esec
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Packaging & Bonding
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1 entry
The Datacon 2200 evo is a die bonder for epoxy die attach applications.
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Models in this family
Datacon 2200 evo
3rd generation
The Datacon 2200 evo is a die bonder for epoxy die attach applications.
Cited variants
Designation
Generation
Vintage
Changes
Source
Datacon 2200 evo plus
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besi.com
[1]
Datacon 2200 evo hF
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besi.com
[1]
Datacon 2200 evo hS
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besi.com
[1]
Datacon 2200 evo advanced
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besi.com
[1]
Sources
Sources (1)
Every fact above is drawn from these public sources
[1]
besi.com
besi.com