Waferpedia

Comparison ledger

10490versus7700E

West Bond 10490, West Bond 7700E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
7700EWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10490West Bond 7700E
Cited variants—
Specifications
ManufacturerWest Bond[2]—
Model10490[2]—
DescriptionConvertible bonder, wedge to ball[3]—
Tool typeConvertible bonder[4]—
Bonding modesWedge bonding and ball bonding[4]—
UseWire bonding[4]—
Wire diameter range—0.0007 inches (minimum, upper limit not stated)[1]
Tool shank diameter—1/16 inch[1]
Tool length—0.625 inch (standard) or 0.750 inch (deeper access)[1]
Spool mount size—1/2 inch ball bearing spool mount[1]
Ultrasonic generator power—4 Watts, dual channel[1]
Number of wire buffers—30[1]
Bonds per wire (maximum)—21[1]
Workholder substrate size (example)—2x2 inches (with mechanical clamp and inert atmosphere cavity)[1]
Bonding method—Thermosonic ball-wedge[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]manualslib.commanualslib.com
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com