Comparison ledger
Tegal 981, Tegal 981ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 981Tegal | 981ACSTegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | 1999 | — |
| Production run | 1999– | — |
| Lifecycle | Legacy | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 981 | Tegal 981ACS |
| Cited variants |
| — |
| Specifications | ||
| process type | plasma etch system[2] | — |
| application focus | thin film head fabrication[3] | — |
| etch result | precise photoresist descum[2] | — |
| anisotropy | 4:1[2] | — |
| processing temperature | low processing temperatures[2] | — |
| plasma chemistry | oxygen-free plasmas[2] | — |
| wafer size variant | 150mm–200mm[1] | — |
| Status | In Storage 8"[4] | — |
| Process type | plasma etch[2] | — |
| Primary function | precise photoresist descum[2] | — |
| Variant designation | 981 ACS[1] | — |
| Variant wafer size | 150mm–200mm[1] | — |
| Variant application | non-critical silicon nitride and photoresist trim processing[1] | — |
| Wafer size (diameter) | — | 150 mm, 200 mm[5] |
| Wafer size (square) | — | 100 mm square, 6-inch square[5] |
| Reactor type | — | Wide-gap diode (scaled-up version of 901ACS)[5] |
| Applications | — | Non-critical photoresist removal, photoresist trimming, large-scale etching, planarization, backside etching, BioChip nanotechnology[5] |
| Footprint | — | Small; no external rack-mount electronics[5] |
| User interface | — | Intuitive touchscreen interface[5] |
| Maintenance | — | Long-lasting, low maintenance parts[5] |
| Wafer handling | — | Cassette to cassette (no manual handling)[5] |
| Temperature control | — | All electrodes precisely temperature controlled[5] |
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