Comparison ledger
SUSS MicroTec BA8 Gen4 Pro, SUSS MicroTec MA200 Gen3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | BA8 Gen4 ProSUSS MicroTec | MA200 Gen3SUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | Gen4 Pro | Gen3 |
| Family | SUSS MicroTec BA8 Gen4 Pro | SUSS MicroTec MA200 Gen3 |
| Specifications | ||
| Wafer size | up to 200 mm[1] | up to 200 mm[1] |
| Automation level | Semi-automated[1] | — |
| Processes | Mask alignment, Bond alignment, Exposure, UV bonding, Fusion bonding, Micro- and Nanoimprinting, Selective plasma activation[1] | — |
| Type | — | Automated system[1] |
| Process | — | Mask Alignment, Exposure[1] |
| Substrate type | — | Wafers and square substrates[2] |
| Exposure modes | — | Proximity, contact, soft contact, hard contact, and vacuum contact exposure[3] |
| Top-side alignment accuracy | — | 0.5 µm[2] |
| Minimum proximity resolution | — | 3.5 µm[2] |
| Minimum vacuum contact resolution | — | <0.8 µm[2] |
| Handling capability | — | Fragile, warped, or ultra-thin wafers down to 50 µm[2] |
| Mask management | — | Integrated mask library stores and manages multiple photomasks[2] |
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