Waferpedia

Comparison ledger

ICPversus1512e

STS ICP, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ICPSTS
1512eTegal
OEMSTSTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySTS ICPTegal 1512e
Cited variants
  • STS ASE ICP DRIE – FluorineICP[1]
  • STS Multiplex ICPICP[2]
—
Specifications
Voltage400 V[3]—
Frequency50 Hz[3]—
TechnologyInductively Coupled Plasma (ICP)[3]—
Tool typeInductively coupled plasma etcher[3]Industrial RIE plasma etcher system[4]
Electrical configuration400 V, 50 Hz[3]—
Process classDry etcher[2]—
Wafer size100 mm wafers[2]—
ChemistryChlorine and bromine chemistry[2]—
Stated configuration—With modules assembly for CI-4222[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]cores.research.asu.educores.research.asu.edu
  2. [2]epfl.chepfl.ch
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com