Comparison ledger
SPTS XeF2, Tegal 1511e, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | XeF2SPTS | 1511eTegal |
|---|---|---|
| OEM | SPTS | Tegal |
| Category | Etch | Etch |
| Wafer size | Up to 6-inch wafers | three- to six-inch wafers |
| Process node | — | — |
| Introduced | — | 1984 |
| Production run | — | 1984– |
| Lifecycle | — | — |
| Lifecycle milestones | 2013 Acquisition of XACTIX, Inc. · 2013 XACTIX acquisition | — |
| Control system | — | — |
| Generation | — | — |
| Family | SPTS XeF2 | Tegal 1511e |
| Specifications | ||
| Etch type | Isotropic etch[1] | — |
| Selectivity | Over 1000:1 between Si/photoresist, Si/SiO2, and Si/SiN[1] | — |
| Gas flow modes | Continuous and pulsed gas flow[1] | — |
| Operating temperature | Room temperature[1] | — |
| Plasma | No plasma[1] | — |
| Substrate size | Up to 6-inch wafers[1] | — |
| Isotropic etch materials | Si, Mo, Ge, W, C[1] | — |
| Gas delivery | Continuous and pulsed gas flow[2] | — |
| tool type | — | tri-electrode dual-frequency plasma etch system[3] |
| wafer size | — | three- to six-inch wafers[3] |
| first sold | — | 1984[3] |
| system characteristic | — | first vacuum-loadlocked dual-frequency tri-electrode etch system[3] |
| First vacuum-loadlocked dual-frequency tri-electrode etch system | — | Yes[3] |
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