Comparison ledger
SPTS CET25, Tegal 1511e, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | CET25SPTS | 1511eTegal |
|---|---|---|
| OEM | SPTS | Tegal |
| Category | Etch | Etch |
| Wafer size | 25-wafer batch | three- to six-inch wafers |
| Process node | — | — |
| Introduced | — | 1984 |
| Production run | — | 1984– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SPTS CET25 | Tegal 1511e |
| Cited variants | — | |
| Specifications | ||
| Process type | HF vapor release etch for MEMS[3] | — |
| Batch size | 25-wafer batch[3] | — |
| Target application | Medium to high volume production applications[3] | — |
| Key benefits | High throughput; process chamber, gas and liquid panel, and pressure control components within a small footprint; extensive process control and monitoring functions[3] | — |
| Configuration support | Various SPTS cluster configurations with the ability to support multiple process modules[3] | — |
| tool type | — | tri-electrode dual-frequency plasma etch system[4] |
| wafer size | — | three- to six-inch wafers[4] |
| first sold | — | 1984[4] |
| system characteristic | — | first vacuum-loadlocked dual-frequency tri-electrode etch system[4] |
| First vacuum-loadlocked dual-frequency tri-electrode etch system | — | Yes[4] |
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