Waferpedia

Comparison ledger

11600 SRDversusCV200 RFS

Semitool 11600 SRD, YES CV200 RFS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11600 SRDSemitool
OEMSemitoolYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size—50mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySemitool 11600 SRDYES CV200 RFS
Specifications
ConfigurationCeramic[1]—
ManufacturerSemitool[1]—
Model11600 SRD[1]—
Equipment typeSpin Rinse Dryer[1]—
Process—Plasma strip / descum system[2]
Wafer size—50 mm to 200 mm[2]
Power supply—Variable Power Supply from 150 W to 1250 W[2]
Resist removal rate—Up to 7000 angstroms per minute[2]
Temperature measurement—Real-time wafer temperature measurement[2]
Temperature control—Flexible temperature control[2]
Gas inputs—Multiple process gas inputs[2]
Design—Unique downstream protective design[2]
Wafer size range—50 mm to 200 mm[2]
Power supply range—150 W to 1250 W[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]pnf.uchicago.edupnf.uchicago.edu