Comparison ledger
Oxford Instruments 100 ICP Fluorine, Trion Apollo, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | ApolloTrion |
|---|---|---|
| OEM | Oxford Instruments | Trion |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Trion Apollo |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | 100mm to 300mm[2] |
| Etch rate (photoresist strip) | — | up to 6 µm/min[2] |
| Plasma source options | — | Inductively Coupled Plasma (ICP) or SST-Lightning microwave[3] |
| RF bias | — | Yes (RIE biased electrode)[4] |
| Tuning | — | Self-tuning / automatic tuning[2] |
| Chuck type | — | Electrostatic chuck with helium backside cooling[4] |
| Wafer handling robot | — | Multi-axis atmospheric robot; transports 150mm, 200mm, and 300mm wafers[4] |
| Process controller | — | PC-based with graphical software; recipes stored on 3.5" disks[4] |
| Physical dimensions (W x D x H) | — | 18" x 50" x 51"[4] |
| Maximum wafer size (stated in source) | — | up to 8" (200mm) — note: source also states robot handles 300mm wafers[4] |
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