Comparison ledger
Oxford Instruments 100 ICP Fluorine, Tegal 900ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | 900ACSTegal |
|---|---|---|
| OEM | Oxford Instruments | Tegal |
| Category | Etch | Etch |
| Wafer size | — | 75mm to 200mm wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | Legacy |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Tegal 900ACS |
| Cited variants | — |
|
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[2] | — |
| Cryo DRIE etch rate | up to 5 µm/min[2] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[2] | — |
| tool type | — | single wafer cassette-to-cassette etch system[1] |
| process type | — | non-critical plasma etch[1] |
| wafer range | — | 75mm to 200mm wafers[1] |
| series | — | ACS series[1] |
| features | — | faster throughput, faster system calibration, touchscreen graphical user interface, integrated data logging, and factory automation support[1] |
| throughput | — | faster throughput[1] |
| system calibration | — | faster system calibration[1] |
| user interface | — | touchscreen graphical user interface[1] |
| data logging | — | integrated data logging[1] |
| automation support | — | factory automation support[1] |
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