Comparison ledger
Oxford Instruments 100 ICP Fluorine, Pfeiffer Alcatel Adixen AMS 200 DRIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | Alcatel Adixen AMS 200 DRIEPfeiffer |
|---|---|---|
| OEM | Oxford Instruments | Pfeiffer |
| Category | Etch | Etch |
| Wafer size | — | Single-Wafer Chamber for Deep Silicon Etch |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Pfeiffer Alcatel Adixen AMS 200 DRIE |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | Single-Wafer Chamber for Deep Silicon Etch[2] |
| Power | — | 400 V, 50/60 Hz, 3-Phase[2] |
| Electrical Feed | — | 480 VAC to Tool[2] |
| Tool Supply | — | 208 V, 500 A, 3-Phase, 4-Wire[2] |
| Process Gases | — | Ar, O2, N2, C4F8, SF6 & He[2] |
| RF Power | — | 5 kW[2] |
| Platen Power | — | 3 kW[2] |
| Cooling | — | Standalone Chiller[2] |
| Cryogenic Cooling | — | No[2] |
| Turbo Pump | — | Removed / Not Included[2] |
| Roughing Pump | — | Removed / Not Included[2] |
| Trap | — | Removed[2] |
| Foreline | — | Removed[2] |
| Wafer Size | — | 8 inch[2] |
| Auto Load/Unload | — | Yes[2] |
| Robot | — | 1 Robot from cassette to chamber[2] |
| Chamber Type | — | Single-Wafer Chamber[2] |
| Process Type | — | Deep Silicon Etch (DRIE)[2] |
| Vacuum & Air Utilities | — | Yes[2] |
| Additional Spares | — | Yes[2] |
| Spare Trap | — | Available[2] |
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