Waferpedia

Comparison ledger

DSS 200 Postversus100R16

Ontrak DSS 200 Post, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100R16Strasbaugh
OEMOntrakStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOntrak DSS 200Strasbaugh 100R16
Cited variants
  • Ontrak DSS200 Series 1[1]
  • Ontrak DSS200 Series 2[2]
—
Specifications
ConfigurationWith Hepa Mini-Environment[3]—
Tool typedouble-sided PVA scrubber[2]—
Wafer size range100mm to 200mm[1]—
Throughput45-65 wafers per hour[2]—
Post-CMP cleaning applicationsoxide, polysilicon, nitride, tungsten, aluminum and copper[2]—
type—1 spindle grinder/polisher[5]
drive system—DC drive system with 2 motors[5]
spindle RPM—1-180 RPM[5]
eccentric RPM—1-90 RPM[5]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[5]
capacity—16 inches[5]
spindle size—1-8 TPI[5]
overall dimensions—28 inches x 36 inches x 48 inches[5]
weight—500 lbs[5]
origin—made in the USA[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]axustech.comaxustech.com
  2. [2]axustech.comaxustech.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]excelltechnology.comexcelltechnology.com