Waferpedia

Comparison ledger

806 Maskversus150 e Mask

OAI 806 Mask, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMOAISUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOAI 806 MaskSUSS MicroTec 150 e Mask
Cited variants—
Specifications
Wafer size6 inch[2]—
Model806[2]—
Model variantMBA 806[1]—
Alignment accuracysubmicron[3]—
Light sourcecollimated UV light source, 350W NUV lamphouse[3]—
Workholdingvacuum chuck[3]—
Microscopeintegrated microscope optics with 5x objectives[3]—
Stagemotorized stage with Thomson Industries Quickslide System[1]—
Contact modessoft, hard, and proximity contact[3]—
Backside alignmentoptional[3]—
Wafer loadingmanual[1]—
Mask holders4 inch (3 inch round opening), 5 inch (4 inch round opening), 7 inch (6 inch round opening)[1]—
BSA chucks3 inch, 4 inch, and 6 inch[1]—
OEMOAI[2]—
Tool typeMask Aligner[2]—
Exposure modessoft contact, hard contact, and proximity contact modes[3]—
Optical sourcecollimated UV light source[3]—
Alignment opticsintegrated microscope optics[3]—
Model designationMBA806[1]—
Manual wafer loadmanual wafer load mask aligner[1]—
Lamphouse350W NUV lamphouse[1]—
Microscope light power supplyincluded[1]—
Objectives5x objectives[1]—
SystemThomson Industries Quickslide System[1]—

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Sources (3)Every fact above is drawn from these public sources
  1. [1]classoneequipment.comclassoneequipment.com
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com