Comparison ledger
Meyer Burger DS 271, Takatori WSD K 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DS 271Meyer Burger | WSD K 3Takatori |
|---|---|---|
| OEM | Meyer Burger | Takatori |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2010 Stated vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Meyer Burger DS 271 | Takatori WSD K 3 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | With HDD & Software[3] | Capable of handling substrates that include:[1] |
| Diameter | 350 mm[3] | — |
| Length | 1061 mm[3] | — |
| Weight | 175 kg[3] | — |
| Number | 2[3] | — |
| Required power | 2 x 75 kW[3] | — |
| Bearing application | special roller bearings, water-cooled[3] | — |
| Horizontal distance between axes | 660 mm[3] | — |
| Wire web working height | 1515 mm[3] | — |
| Wire web width | 1030 mm[3] | — |
| Loading length | 1020 mm[4] | — |
| Max workpiece dimensions | 220 x 220 mm[4] | — |
| Workpiece holders | 4 x 255 mm, 3 x 340 mm, 2 x 510 mm, 1 x 1020 mm[4] | — |
| Wire diameter | 100–160 micron[4] | — |
| Wire speed | 15 m/sec[4] | — |
| Wire guide rolls diameter | 350 mm[4] | — |
| Diamond wire upgrade | Water based upgrade installed[5] | — |
| Vintage | 2010/2011[4] | — |
| Wire guide roller diameter | 350 mm[3] | — |
| Wire guide roller length | 1061 mm[3] | — |
| Wire guide roller weight | 175 kg[3] | — |
| Wire guide roller count | 2[3] | — |
| Capable substrates | — | Silicon Carbide (SiC), Sapphire, Quartz crystal and optical materials, Compound semiconductors (GaAs, GaN, InP)[1] |
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