Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond wirebond2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | wirebond2West Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond wirebond2 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| OEM | — | West Bond[2] |
| Model | — | 4546E[2] |
| Equipment type | — | semi-automatic wedge bond tool[2] |
| Motion control | — | microprocessor controllable motion in Z and Y axes[2] |
| Bonding method | — | uses ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages[2] |
| Typical configured wire | — | 1 mil (25 μm) Al wire[2] |
| Convertible wedge angle | — | 45° wedge and 90° (deep access) wedge bonding[2] |
| Compatible wire materials and sizes | — | Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding[2] |
| Heated workholders | — | Multiple heated workholders available[2] |
| Transducer | — | 5 W, 63 kHz[2] |
| Bond placement aid | — | look down camera and screen[2] |
| Bonding control | — | programmable bonding steps for repeatable wire profile control[2] |
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