Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, MRSI 705HF, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 705HFMRSI |
|---|---|---|
| OEM | Logitech | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | Windows |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | MRSI 705HF |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Machine type | — | 5-micron high force die bonder[2] |
| Bond head | — | Heated bond head[2] |
| Maximum force | — | Up to 500N[2] |
| Top heating temperature | — | Up to 400°C[2] |
| Placement accuracy | — | +/- 5 microns or better[2] |
| Work area | — | 700 sq.in[2] |
| Maximum waffle packs | — | Up to 90 when using the Sector Plate Shuttle[2] |
| Force at component | — | As low as 10 grams[2] |
| Motion axes | — | Up to 32 axes of motion[2] |
| Linear encoder resolution | — | 0.1-micron resolution[2] |
| Tool bank | — | Thirteen-position tool bank with fast automatic tool change[2] |
| Control platform | — | Windows GUI[2] |
| Integration | — | SMEMA compatibility[2] |
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