Waferpedia

Comparison ledger

1 DP 41versusEP1

Logitech 1 DP 41, Logitech EP1, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1 DP 41Logitech
EP1Logitech
OEMLogitechLogitech
CategoryCMPCMP
Wafer size—100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 DP 41Logitech EP1
Specifications
Phase3 Phase[1]—
Configuration50/60 Hz[1]—
Voltage480 V[1]—
MakeLogitech[1]—
Model1 DP 41[1]—
Frequency50/60 Hz[1]—
Current12 amps[1]—
Product family—EP Polishing Pads and Cloths[2]
Application type—Chemical Mechanical Polishing (CMP)[2]
Suitable applications—oxide, nitride and copper[2]
Type—Chemical Mechanical Polishing (CMP) cloths and pads[2]
Suitable materials—Oxide, nitride and copper[2]
Product type—Chemical Mechanical Polishing (CMP) polishing cloths and pads[2]
Applications—oxide, nitride, and copper[2]
Associated wafer process capacity—up to 100mm/4"[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org