Comparison ledger
Laurell H6-15, Laurell WS-650-8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | H6-15Laurell | WS-650-8Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 300mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Laurell H6-15 | Laurell WS-650-8 |
| Cited variants | — |
|
| Specifications | ||
| Model | H6-15[2] | WS-650-8B[1] |
| Series | 650-series HL coater system[2] | 650-series[1] |
| Maximum wafer size | Up to ø 300mm wafers[2] | — |
| Maximum substrate size | 9" × 9" (229mm × 229mm) substrates[2] | — |
| Maximum rotational speed | 12,000 RPM[2] | 12,000 RPM[1] |
| Controller/software | Wireless tablet featuring Laurell Touch process control software; accompanying PC software Spin 3000 is also mentioned[2] | — |
| Power | 95 to 240VAC, 47/63HZ, ~300 Watts[2] | 95 to 240VAC, 47/63HZ, ~300 Watts[1] |
| Required nitrogen/CDA purge | 60–70 PSIG (4–5 bar)[2] | — |
| Vacuum | 25–28 inches Hg suggested; 4.5 SCFM at 0 inches Hg[2] | — |
| Wafer size | up to ø 300mm wafers[2] | — |
| Substrate size | 9" × 9" (229mm × 229mm) substrates[2] | — |
| Speed basis | based on a ø 100mm silicon wafer[2] | — |
| Control software | Laurell Touch process control software with accompanying Spin 3000 PC software[2] | — |
| Controller | wireless tablet[2] | — |
| Gas purge | 60–70 PSIG Nitrogen/CDA[2] | — |
| Product type | — | Spin coater[1] |
| Wafer capacity | — | Up to 200 mm wafers[1] |
| Substrate capacity | — | Up to 7 in x 7 in (178 mm x 178 mm) substrates[1] |
| Basis for max speed rating | — | Based on a 100 mm silicon wafer[1] |
| Process controller | — | 650-series process controller with robust microprocessor and accompanying PC software[1] |
| Power requirement | — | 95 to 240 VAC, 47/63 Hz, approximately 300 W[1] |
| Nitrogen/CDA process/seal purge | — | 60 to 70 PSIG (4 to 5 bar)[1] |
| Vacuum suggestion | — | 25 to 28 inches Hg; 4.5 SCFM at 0 inches Hg[1] |
| Applications | — | Coating, etching, developing, rinsing-drying, and cleaning[1] |
| Category | — | Spin coater[1] |
| Speed reference condition | — | Based on a 100mm silicon wafer[1] |
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