Comparison ledger
Lapmaster 12 Benchtop Lapping Polishing, Ontrak DSS 200 Post, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | DSS 200 PostOntrak |
|---|---|---|
| OEM | Lapmaster | Ontrak |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 12 Benchtop Lapping Polishing | Ontrak DSS 200 |
| Cited variants | — | |
| Specifications | ||
| Make | Lapmaster[4] | — |
| Model | 12[4] | — |
| Category | CMP[5] | — |
| Type/Application | Single sided[6] | — |
| Plate diameter | 12 in[6] | — |
| No. of conditioning rings | 3[7] | — |
| Configuration | Ring lapper[7] | With Hepa Mini-Environment[9] |
| Base | Rigid, lightweight, cast aluminum base[7] | — |
| Standard RPM | 60 RPM[7] | — |
| RPM range with variable speed drive | 0-60[7] | — |
| Drive motor - lapper | 0.5 HP[7] | — |
| Drive motor - polisher | 0.75 HP[7] | — |
| Length | 25 in[7] | — |
| Width | 18 in[7] | — |
| Height | 24 in[7] | — |
| Estimated shipping weight | 240 lbs[7] | — |
| Approximate weight | 135 lbs / 61 kg[8] | — |
| Approximate dimensions | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[8] | — |
| Electrical system | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[8] | — |
| Motor | 1/3 hp / 0.25 kW motor with gear reducer[8] | — |
| Abrasive feed system | Designed for water or oil based lapping slurries[8] | — |
| Automatic cycle timer | Automatic digital cycle timer[8] | — |
| Ring configuration | Ring lapper[7] | — |
| Ring ID | 4.25 inches[7] | — |
| Tool type | — | double-sided PVA scrubber[2] |
| Wafer size range | — | 100mm to 200mm[1] |
| Throughput | — | 45-65 wafers per hour[2] |
| Post-CMP cleaning applications | — | oxide, polysilicon, nitride, tungsten, aluminum and copper[2] |
| Type | — | Double-sided PVA scrubber / post-CMP cleaner[2] |
| Wafer sizes (listing) | — | 8 inch[9] |
| Cleanroom environment (listing) | — | With HEPA mini-environment[9] |
| Brush type | — | Roller PVA[3] |
| Downforce control | — | Yes[3] |
| Drying method | — | Spin + heat lamp[3] |
| NH4OH dispense | — | Yes[3] |