Comparison ledger
Lam Research IPEC 372 M, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | IPEC 372 MLam Research | 12 LapperLapmaster |
|---|---|---|
| OEM | Lam Research | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research IPEC 372 M | — |
| Specifications | ||
| Category | CMP[1] | — |
| Wafer Size | 8 inch (200 mm)[1] | — |
| Type | Automated Wafer Polishing System[2] | — |
| OEM | Lam Research[1] | — |
| Model | IPEC 372 M[3] | — |
| Wafer sizes | 8 inch[3] | — |
| Tool type | Automated wafer polishing system[1] | — |
| Also referred to as | IPEC 372M Avanti[1] | — |
| Outside plate diameter | — | 12 inches[4] |
| Lapping Speed Range | — | 0 to 60 rpm[5] |
| Wafer Size Compatibility | — | 4 inches or smaller[4] |
| Input Voltage | — | 110 V[4] |
| Frequency | — | 60 Hz[4] |
| Phase | — | 1[4] |
| Number of Rings | — | 3[4] |
| Number of Weights | — | 3[4] |
| Includes Slurry System | — | Yes[4] |
| Includes Timer | — | Yes[4] |