Comparison ledger
Kurt Lesker Nano36, YES 1000FP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Nano36Kurt Lesker | 1000FPYES |
|---|---|---|
| OEM | Kurt Lesker | YES |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kurt Lesker Nano36 | YES 1000FP |
| Specifications | ||
| OEM | Kurt J Lesker[1] | — |
| Model | Nano36 Thermal Deposition System[1] | Glen/YES 1000FP[3] |
| Equipment type | Cleanroom Instrumentation[1] | — |
| Process category | Thin Film Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Equipment Type | Cleanroom Instrumentation; Thin Film Fabrication[2] | — |
| Deposition type | thermal deposition of metals[2] | — |
| Substrate size | up to 150 mm in diameter[2] | — |
| Automated process control | KJL eKLipse software with a graphical recipe builder[2] | — |
| Deposition sources | two thermal sources for co-deposition and four sources for sequential deposition[2] | — |
| Source characteristics | DC power supply rated up to 12 V or 400 A; maximum applied power 2 kW[2] | — |
| Shutters and shielding | substrate and source shutters with cross-contamination shields[2] | — |
| Substrate rotation | up to 20 rpm[2] | — |
| Thickness monitoring | two crystal sensors with controller-based deposition rate and film thickness control[2] | — |
| System base pressure | 5.0 × 10^-6 Torr[2] | — |
| Film uniformity | <8%[2] | — |
| System type | — | Plasma cleaning system[3] |
| Line | — | R-Series Plasma Cleaning Systems (Glen Technologies)[3] |
| Designed use | — | Designed to accept a range of shelf sizes[3] |
| Application focus | — | Changing needs of the flat panel industry[3] |
Plan your fab
Building a Wet Processing / Clean process? Get a complete equipment list.
Open the fab equipment planner →