Comparison ledger
KLA 1.112 PSL Wafer, Orbotech Ultra Fusion 300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Ultra Fusion 300Orbotech | |
|---|---|---|
| OEM | KLA | Orbotech |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 1.112 PSL Wafer | Orbotech Ultra Fusion 300 |
| Specifications | ||
| Configuration | NIST Traceable[1] | — |
| Wafer Size | 8 inch[1] | — |
| NIST Traceable | True[1] | — |
| Compatible Tools | Surfscan 6xy0 and Sp1[2] | — |
| Technology Range | — | Down to 0.4mil (10μm) line & space[3] |
| Panel Dimensions (max) | — | 24" x 30" (610mm x 762mm)[3] |
| Panel Thickness Range | — | 1-300mil (25-7,500μm)[3] |
| Weight | — | 900 kg[3] |
| Dimensions (W x D x H) | — | 161cm x 178cm x 186cm[3] |
| Inspection Methods | — | Full reference comparison, Multi-Image technology, model-based contour comparison, full multi-layer panel understanding[3] |
| Detected Defects | — | Shorts, opens, minimum line/space violations, nicks, protrusions, dishdowns, copper splashes, pinholes, missing or excess features, wrong size and position, clearance and split plane violations, blocked holes, annular ring violations, SMT violations, black spots, wire bonding pad defects, flip chip pad defects, defects in through blind vias[3] |
| False Alarm Reduction | — | Up to 70% reduction compared to conventional AOI[3] |
| Setup Method | — | Smart Setup: single cycle, non-iterative, automatic generation of all parameters[3] |
| Panel Registration | — | Pinless registration – panel edge alignment and online dynamic registration[3] |
| Options | — | Marker and stamper, 2D barcode reader, RMIV Pro option, 2D Metrology[3] |
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