Comparison ledger
Heidelberg Instruments DWL66, OAI 806, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DWL66Heidelberg Instruments | 806OAI |
|---|---|---|
| OEM | Heidelberg Instruments | OAI |
| Category | Lithography | Lithography |
| Wafer size | 6" | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Heidelberg Instruments DWL66 | OAI 806 |
| Cited variants |
| — |
| Specifications | ||
| Resolution | 40 nm, 100 nm, 200 nm, 400 nm[2] | — |
| Minimum feature | 0.5 µm[2] | — |
| Laser sources | 244 nm, 363 nm, 413 nm, 442 nm[2] | — |
| Substrates | glass, silicon or any other flat materials[2] | — |
| Exposure | photoresist[2] | — |
| Image size | 140 mm x 140 mm[2] | — |
| Substrate size | up to 200 mm by 200 mm[1] | up to 6 inches[3] |
| Model | — | OAI 806 Mask Aligner[3] |
| Patterning substrate size | — | up to 6 inches[3] |
| Contact modes | — | soft, hard, and proximity contact modes[3] |
| Alignment accuracy | — | submicron[3] |
| UV source | — | collimated UV light source[3] |
| Workholding | — | vacuum chuck[3] |
| Optics | — | integrated microscope optics[3] |
| Stage | — | motorized stage[3] |
| Optional capability | — | backside alignment[3] |
| Light source | — | collimated UV[3] |
| Backside alignment | — | optional[3] |
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