Comparison ledger
EV Group EV 501 Wafer, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EV 501 WaferEV Group | 10100West Bond |
|---|---|---|
| OEM | EV Group | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Capable of thermo compression, fusion or anodic wafer bonding | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group EV 501 Wafer | West Bond 10100 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | Refurbished[2] | — |
| Wafer size | Capable of thermo compression, fusion or anodic wafer bonding[2] | — |
| Thickness | Max wafer stack thickness 6 mm[2] | — |
| Bottom side heater | 550°C max. in 1°C steps[2] | — |
| Temperature uniformity | ± 1,5 %[2] | — |
| Bonding capability | Capable of thermo compression, fusion or anodic wafer bonding[2] | — |
| Bond chamber | Bond chamber for small pieces up to 150 mm wafers (with correct tooling)[2] | — |
| Vacuum pump | Turbo Pump[2] | — |
| Power supply | High voltage power supply for anodic bonding (additional tooling may be required)[2] | — |
| Electronics | Electronics Rack[2] | — |
| Control/software | Computer & Software[2] | — |
| Display | LCD Monitor[2] | — |
| Pump | Roughing Pump[2] | — |
| Manual | Operations Manual[2] | — |
| Condition | Refurbished[2] | — |
| Wafer sizes supported | 2, 3, 4, 5, 6, 12 inch[2] | — |
| Max wafer stack thickness | 6 mm[2] | — |
| Bottom side heater max temperature | 550°C max.[2] | — |
| Heater temperature step | 1°C steps[2] | — |
| Roughing pump | Roughing Pump[2] | — |
| High voltage power supply | High voltage power supply for anodic bonding (additional tooling may be required)[2] | — |
| Electronics rack | Electronics Rack[2] | — |
| Computer & software | Computer & Software[2] | — |
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