Waferpedia

Comparison ledger

301versus1000P

EV Group 301, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
301EV Group
OEMEV GroupYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyEV Group 301YES 1000P
Specifications
Cleaning typeAqueous-based (DI water) megasonic cleaning[1]—
Spinner rotationUp to 3000 RPM[1]—
DI-water flow rateUp to 1.5 l/min[1]—
Megasonic nozzle frequency1 MHz[1]—
Megasonic nozzle output power30–60 W[1]—
Bonding stationDirect bonding (flat to flat) station[1]—
Inspection moduleIR-inspection (lamp/camera) module[1]—
EnvironmentClass 1 mini environment with HEPA filters and ionizer[1]—
Wafer diameter200 mm, 100 - 300 mm[2]—
Cleaning systemAqueous-based (DI water) megasonic cleaning; solvent cleaning option[1]—
Pre-bonding stationDirect bonding (flat to flat) station[1]—
IR-inspection moduleIR-inspection (lamp/camera) module[1]—
Class 1 mini environmentHEPA filters + ionizer[1]—
Brush scrubbing optionAvailable for single-side cleaning[2]—
Substrate size200, 100–300 mm[3]—
Rotation speedup to 3000 rpm[3]—
Megasonic nozzlefrequency 1 MHz, output 30–60 W[3]—
Effective cleaning areaφ4.0 mm[3]—
Power supplysingle‑phase 200 V, 50/60 Hz[3]—
Cleaning system typeOpen chamber, spinner and cleaning arm[2]—
Chamber materialPP or PFA (option)[2]—
Cleaning mediaDI-water (standard), other (option)[2]—
Spinner chuckvacuum chuck (standard), edge handling chuck (option)[2]—
Rotationup to 3000 rpm[2]—
Megasonic effective cleaning areaØ 4.0 mm[2]—
Megasonic nozzle materialPTFE[2]—
Megasonic area transducer frequency1 MHz (3 MHz option)[2]—
Megasonic area transducer output powermax. 2.5 W/cm² active areas (max. 200 W)[2]—
Brush materialPVA[2]—
IR-inspectionlamp/camera module[1]—
Model—1000P[4]
System type—Plasma cleaning system[4]
Shelf configuration—Four 16 x 16 inch shelves[4]
Total capacity—1024 square inches[4]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[4]
Number of shelves—4[4]
Shelf size—16 x 16 inches[4]
Power—1000 W[5]
Configuration—Parallel plate[5]
Operation modes—Active, RIE, Downstream[4]
Sample size range—From smallest semiconductor chip to large flat panels[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]evgroup.comevgroup.com
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org
  5. [5]semistarcorp.comsemistarcorp.com